Superconducting flip-chip devices using indium microspheres on Au-passivated Nb or NbN as under-bump metallization layer
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Data used for figures in "Superconducting flip-chip devices using indium microspheres on Au-passivated Nb or NbN as under bump metallization layer" by A. Paradkar et al. Appl. Phys. Lett. 126, 022601 (2025)
创建时间：
2025-01-20
