ADHESIVE SUBSTANCE， IN PARTICULAR FOR ENCAPSULATING AN ELECTRONIC ASSEMBLY
收藏国家林业和草原科学数据中心2023-02-12 更新2024-03-07 收录
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The invention relates to an adhesive substance， in particular for encapsulating an electronic assembly against permeates， said substance comprising: (a) at least one copolymer containing at least isobutene or butene as comonomer types and at least one comonomer type which， when regarded as a hypothetical homopolymer， has a softening temperature greater than 40°C; (b) at least one type of an at least partially hydrogenated adhesive resin; (c) at least one acrylate- or methacrylate-based type of reactive resin with a softening temperature less than 40 °C， preferably less than 20°C; and (d) at least one type of photoinitiator for initiating radical curing. The invention relates to an adhesive substance， in particular for encapsulating an electronic assembly against permeates， said substance comprising: (a) at least one copolymer containing at least isobutene or butene as comonomer types and at least one comonomer type which， when regarded as a hypothetical homopolymer， has a softening temperature greater than 40°C; (b) at least one type of an at least partially hydrogenated adhesive resin; (c) at least one acrylate- or methacrylate-based type of reactive resin with a softening temperature less than 40 °C， preferably less than 20°C; and (d) at least one type of photoinitiator for initiating radical curing.
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国家林业和草原科学数据中心
创建时间：
2023-02-12
