Numerical Result Data for a 220–330 GHz Co-Packaged Air-Gap-Fed Horn Interconnect
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Numerical result data and figure-reproduction materials supporting Figures 4–9 of the manuscript “Broadband Electromagnetic Modeling and Design-Margin Analysis of a 220–330 GHz Co-Packaged Air-Gap-Fed Horn Interconnect.” The deposited materials include broadband input-reflection data, processed near-field and forward-power-flow maps, geometric-sensitivity data, worst-case matching margins, analytical aperture-reference data, and a plotting script for reproducing the public-data views. The complete parameterized finite-element mother model and full model-generation source code are not included because they form part of ongoing prototype-development work.
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Zenodo创建时间:
2026-09-29



