磁控溅射Ag膜磨斑微结构与耐磨机理研究

在铜基底上制备了磁控溅射银膜，采用激光共聚焦显微镜(LSCM)、透射电镜(TEM)、扫描电子显微镜(SEM)及电子背散射衍射(EBSD)等分析技术对载流摩擦试验后的磨斑微结构进行了分析. 结果表明：磨斑表面较平滑，可见犁沟、微坑及塑性流动等形貌，磨斑边缘存在堆积和剥落. 磨斑表面颗粒形态为短棒状和球状，颗粒尺寸为20~150 nm. 磨斑微结构中存在(012)和有利的(111)择优取向，晶粒平均粒度为582 nm，多数晶粒极细小，起到细晶强化作用. 在磨斑微结构中发现大量孪晶，(111)取向孪晶占比达到93.5%，这种高密度孪晶夹杂非孪晶的微结构，有利于材料内部的滑移和提高耐磨性. 在孪晶界发现存在大量{111}晶面族层错结构，有利于材料晶粒间滑移并提升宏观摩擦性能.

Silver thin films were prepared on copper substrates via magnetron sputtering. The microstructures of wear scars after current-carrying friction tests were characterized using analytical techniques including Laser Scanning Confocal Microscopy (LSCM), Transmission Electron Microscopy (TEM), Scanning Electron Microscopy (SEM), and Electron Backscattered Diffraction (EBSD). The results show that the wear scar surface is relatively smooth, with morphologies such as furrows, micro-pits, and plastic flow observed; accumulation and spalling are present at the edges of the wear scars. The particles on the wear scar surface exhibit short-rod and spherical morphologies, with particle sizes ranging from 20 to 150 nm. Two preferred orientations, (012) and favorable (111), are detected in the wear scar microstructure. The average grain size is 582 nm, and most grains are extremely fine, which contributes to fine-grain strengthening. A large number of twins are found in the wear scar microstructure, among which (111)-oriented twins account for 93.5%. This microstructure with high-density twins intertwined with non-twin regions facilitates internal slip in the material and improves wear resistance. Abundant stacking fault structures of the {111} crystal plane family are observed at twin boundaries, which promotes intergranular slip in the material and enhances macroscopic friction performance.

搜集汇总

背景与挑战

背景概述

该数据集研究了磁控溅射银膜在铜基底上的磨斑微结构及其耐磨机理，通过多种显微技术分析了磨斑表面的形貌和微结构特征，发现高密度孪晶和层错结构有助于提高材料的耐磨性。数据集由华北电力大学和内蒙古科技大学的学者共同完成，发布于2023年，数据量8.66MB。