IEEE Electronics Packaging Society TC-EDMS Benchmark: Problem 3 - Power Integrity
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https://ieee-dataport.org/documents/ieee-electronics-packaging-society-tc-edms-benchmark-problem-3-power-integrity
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资源简介：
The Packaging Benchmark Suite by IEEE Electronics Packaging Society (EPS) Technical Committee on Electrical Design, Modeling and Simulation (TC-EDMS) aims to provide information about electromagnetic, electrical and circuit modeling and simulation problems encountered and the computational methods used when designing, analyzing, and developing electronic packages.This is Benchmark Problem #3 in the suite.
提供机构：
Fei Guo; Wui-Weng Wong
