In situ microstructure and stress control during laser processing

Laser technologies are the key for delivering industry 4.0. Due to the high cooling rate, the formation of undesirable microstructural features such as cracks and pores are common. These limitations have hindered laser technology from reaching its full industrial potential. Manipulating the thermal field has the potential to satisfactorily control the microstructure and residual stress. A secondary laser can provide flexible and controllable approach to achieve thermal manipulation. However, this new approach cannot be fully evaluated using traditional a posteriori techniques due to the transient nature. We developed a laser system, enabling the elucidation of underlying physics in situ. Here, we propose to combine ID31’s high energy range with our in situ laser system. We will perform in situ synchrotron XRD at ESRF to under-stand the mechanism of microstructure and stress evolution during laser processing and how a secondary laser can manipulate and improve the process.