Coin Bump Dataset

This dataset contains optical triangulation measurements and corresponding ground-truth height maps of semiconductor coin bumps with a nominal design height of 10 µm. The coin bump test wafer used for data acquisition was provided by ATI. Optical measurements were acquired using a line-scan CCD camera, with the same wafer areas scanned 10 sequential times under identical conditions. Ground-truth height maps were obtained using Coherence Scanning Interferometry (CSI). The dataset was constructed for training and evaluating deep learning methods for micro-bump height estimation and scan-to-scan repeatability analysis. Further details on preprocessing, dataset splits, and usage are provided in the accompanying GitHub repository and publication.