Data underlying the article "Co-Packaged Electronics with Microfluidics for Direct-to-Package Cooling"
收藏Figshare2026-01-15 更新2026-04-28 收录
下载链接：
https://figshare.com/articles/dataset/Data_underlying_the_article_Co-Packaged_Electronics_with_Microfluidics_for_Direct-to-Package_Cooling_/31073227
下载链接
链接失效反馈官方服务：
资源简介：
The approach of co-packaging electronics with microfluidics for direct-to-package cooling has been demonstrated in this paper. The dataset provided displays the post-processed experimental data to reproduce the results demonstrated in this study.
创建时间：
2026-01-15
