Code, instances and results for: When does reliability-aware die placement differ from temperature-optimal placement? Fatigue-mechanism switching in power-module layout

Supplement to the manuscript “When does reliability-aware die placement differ from temperature-optimal placement? Fatigue-mechanism switching in power-module layout”, submitted to Microelectronics Reliability (manuscript version v4.4). Exact die placement for IGBT power modules with a transient thermal kernel and bond-wire and die-attach fatigue; registered comparison of lifetime-optimal and temperature-optimal layouts (16 cases), thermal-FEA check, post-registration sensitivity analysis. The record contains code, problem instances, result files, CalculiX input decks and logs, protocol records with commit history, and figures, in code.zip, results.zip, fea.zip (≈3.9 GB) and docs.zip, each with a SHA-256 checksum file; MANIFEST.sha256 lists all checksums. See README.md for the contents of each archive and reproduction instructions. Code is under the MIT License; data are under CC BY 4.0. All data are synthetic or simulated; no industrial data are included.