手机拆解三维建模部件与参数数据集

该数据为基于手机拆解流程的三维建模基础数据集合，涵盖主流手机品牌（如华为、苹果、小米、OPPO、vivo）不同机型的核心部件（主板、屏幕模组、电池、摄像头模组、充电接口）、结构部件（中框、后盖、按键）及附属部件（扬声器、麦克风、振动马达）等 12 + 类部件的拆解与建模数据。通过标准化拆解流程采集部件信息，同步记录部件物理参数（尺寸、重量、材质）、拆解参数（拆解工具、拆解力度、拆解步骤耗时）及三维建模参数（点云密度、模型精度、纹理映射精度），为手机拆解三维建模算法优化、拆解流程标准化、部件复用与回收管理提供数据支撑，可直接用于手机部件三维重构、拆解路径规划、维修方案模拟等场景的验证与优化。

This dataset is a foundational data collection for 3D modeling based on smartphone disassembly processes. It covers disassembly and modeling data for over 12 categories of components across various models of mainstream smartphone brands including Huawei, Apple, Xiaomi, OPPO and vivo. These components are categorized into core components (motherboard, screen module, battery, camera module, charging port), structural components (middle frame, rear cover, buttons) and auxiliary components (speaker, microphone, vibration motor). Component information is collected via standardized disassembly procedures, with simultaneous recording of component physical parameters (dimensions, weight, material), disassembly parameters (disassembly tools, disassembly force, time consumed per disassembly step) and 3D modeling parameters (point cloud density, model accuracy, texture mapping accuracy). This dataset provides data support for the optimization of 3D modeling algorithms for smartphone disassembly, standardization of disassembly procedures, component reuse and recycling management, and can be directly applied to verification and optimization in scenarios such as 3D reconstruction of smartphone components, disassembly path planning and maintenance plan simulation.

搜集汇总

背景与挑战

背景概述

该数据集是一个基于手机拆解流程的三维建模基础数据集合，涵盖华为、苹果等主流品牌机型的多种部件，并记录物理参数、拆解参数和三维建模参数。它支持手机拆解算法优化、流程标准化和部件回收管理，适用于三维重构和维修方案模拟等场景，数据格式为Excel。