芯片Substrate折弯展开数据

原始数据为折弯尺寸；ic框架生产需要生产引脚平片产品，但是部分客户只发引脚折弯后的芯片图纸，通过该算法可以算出客户产品折弯展开的尺寸（平片引脚尺寸）用于后续的冲压生产。原始数据1为折弯尺寸，原始数据2为材料厚度，原始数据3为折弯角度，对折弯尺寸中的直身尺寸直接取出，对折弯处进行折弯补偿（补偿弯值为算法核心），将补偿值加入直段尺寸得出处理后数据 原始数据1+0.5*原始数据2*（180-原始数据3）/90=折弯展开数据

The raw input data consists of bending dimensions. For the production of flat lead products in IC frame manufacturing, some customers only provide chip drawings with bent leads. This algorithm can calculate the unfolded bending dimensions (flat lead dimensions) of the customer's product for subsequent stamping production. Specifically, Raw Data 1 represents the bending dimension, Raw Data 2 is the material thickness, and Raw Data 3 corresponds to the bending angle. The straight segment dimensions extracted directly from the bending dimensions will undergo bending compensation, where the compensation bending value is the core of the algorithm. The final processed data is obtained by adding the compensation value to the straight segment dimensions. The calculation formula for the unfolded bending dimension data is: Raw Data 1 + 0.5 * Raw Data 2 * (180 - Raw Data 3) / 90 = Unfolded bending dimension data.