"IEEE Electronics Packaging Society TC-EDMS Benchmark: Problem 1 - Package Microstrip"
收藏DataCite Commons2025-06-23 更新2026-05-03 收录
下载链接：
https://ieee-dataport.org/documents/ieee-eps-edms-package-benchmark-problem-1-package-microstrip
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资源简介：
"The Packaging Benchmark Suite by IEEE Electronics Packaging Society (EPS) Technical Committee on Electrical Design, Modeling and Simulation (TC-EDMS) aims to provide information about electromagnetic, electrical and circuit modeling and simulation problems encountered and the computational methods used when designing, analyzing, and developing electronic packages.This is Benchmark Problem #1 in the suite. "
提供机构：
IEEE DataPort
创建时间：
2025-06-23
