"IEEE Electronics Packaging Society TC-EDMS Benchmark: Problem 1 - Package Microstrip"
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"The Packaging Benchmark Suite by IEEE Electronics Packaging Society (EPS) Technical Committee on Electrical Design, Modeling and Simulation (TC-EDMS) aims to provide information about electromagnetic, electrical and circuit modeling and simulation problems encountered and the computational methods used when designing, analyzing, and developing electronic packages.This is Benchmark Problem #1 in the suite. "
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IEEE DataPort创建时间：
2025-06-23
