高杂波抑制太赫兹混频器芯片数据集

包含太赫兹混频器芯片的各项指标数据和研究过程数据，包括该系统实验研究过程图表（系统装置图、矢量网络分析仪S参数测试、输出频谱/输出功率测试等）、原始记录数据及验收报告。以高杂波抑制混频芯片为研究目标，重点开展器件模型高精度表征、低损耗宽带无源拓扑结构建模、高效功率放大电路新型拓扑结构等研究工作，并从材料-器件-模型-电路实现跨尺度复合设计，实现超宽带太赫兹电子器件的性能优化，解决太赫兹电子器件工作带宽窄、放大效率低、输出功率弱和变频损耗高等技术难点，达到混频器插损≤17dB的技术指标。部分数据采用实地拍摄，部分数据采用标准化仪器采集，部分数据通过MATLAB软件对测试数据处理后得到，汇总构成2020YFB1805702课题超宽带太赫兹电子器件数据集。This dataset includes various performance indicator data and research process data of terahertz mixer chips, such as charts from the system's experimental research (system setup diagram, S-parameter test using vector network analyzer, output spectrum and output power test, etc.), original recorded data, and acceptance reports. Focusing on high-clutter-suppression mixer chips as the research objective, this work conducts in-depth studies on high-precision characterization of device models, modeling of low-loss broadband passive topologies, and novel topologies of high-efficiency power amplifier circuits. It implements cross-scale composite design across materials, devices, models and circuit implementation to optimize the performance of ultra-wideband terahertz electronic devices, addressing the technical bottlenecks including narrow operating bandwidth, low amplification efficiency, weak output power and high frequency conversion loss of terahertz electronic devices, and achieving the technical index of mixer insertion loss ≤17 dB. Part of the data was collected via on-site photography, part was acquired by standardized instruments, and the rest was obtained by processing test data with MATLAB software. The aggregated dataset is the Ultra-wideband Terahertz Electronic Devices Dataset under the project 2020YFB1805702.

搜集汇总

背景与挑战

背景概述

该数据集聚焦于高杂波抑制太赫兹混频器芯片，包含其指标数据和研究过程数据，如实验图表、原始记录和验收报告。研究重点在于器件模型表征和电路设计，旨在优化太赫兹电子器件性能，解决带宽窄、效率低等技术难点，并达到混频器插损≤17dB的技术指标。