聚合物基热界面材料纵向热导率测量数据集

纵向热导率主要面向聚合物基热界面材料研究建设，基于中国科学院深圳先进技术研究院、上海交通大学的热导仪（
仪器型号：LW 9389，测试标准ASTM D 5470），主要记录了对BN/有机硅热界面材料、本征型聚合物、取向碳基热界面材料纵向热导率的观测值，数据量40 MB.

This dataset was primarily constructed for research on polymer-based thermal interface materials. It utilizes a thermal conductivity tester developed by the Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, and Shanghai Jiao Tong University, with the instrument model LW 9389 and tested in compliance with ASTM D 5470. The dataset mainly records measured through-thickness thermal conductivity values of BN/silicone-based thermal interface materials, intrinsic polymers, and oriented carbon-based thermal interface materials, with a total data size of 40 MB.

搜集汇总

背景与挑战

背景概述

该数据集针对聚合物基热界面材料的纵向热导率研究，基于热导仪和ASTM D 5470测试标准，包含了BN/有机硅热界面材料、本征型聚合物及取向碳基热界面材料的纵向热导率观测值。数据规模为130MB，共包含50个文件。