Dataset of Multilayer Rectangle-shaped Planar Windings

Description:------------This open-source dataset contains physical and geometric layout parameters of Multilayer Rectangle-Shaped Planar Windings (MLRPWs) alongside their corresponding self-inductances. The dataset integrates large-scale 3D Finite Element Analysis (FEA) numerical simulations generated via ANSYS Maxwell 3D together with empirical laboratory measurements from physically fabricated Printed Circuit Board (PCB) prototypes. The data is structured into three distinct subsets across dedicated worksheets:1. 'CORE' (#10,110 samples): Synthetic in-distribution dataset used for model training and interpolation benchmarking.2. 'OOD' (#1,124 samples): Synthetic out-of-distribution dataset spanning seven distinct geometric edge-case classes used to benchmark model extrapolation.3. 'MEAS' (#55 samples): Empirical laboratory measurements of physically fabricated PCB prototypes used for real-world hardware verification. File Format:------------The dataset is provided as a Microsoft Excel workbook: - File: dataset_planar_windings_v1.1.xlsx Worksheet Breakdown: - Sheet 'INFO': Contains dataset metadata, variable definitions, and unit notes. - Sheet 'CORE': Synthetic FEA training and in-distribution test subset. - Sheet 'OOD' : Synthetic FEA out-of-distribution extrapolation subset. - Sheet 'MEAS': Hardware dimensions and experimental laboratory measurements. Variables and Units:--------------------All geometrical dimensions and electrical values are provided in standard SI base units (meters [m] for distance, Henrys [H] for self-inductance). - D1 : External outer side length 1 of the winding (m) - D2 : External outer side length 2 of the winding (m) - d1 : Internal aperture side length 1 (m) - d2 : Internal aperture side length 2 (m) - w : Width of the copper trace (m) - s : Horizontal spacing between consecutive turns (m) - NT : Number of turns per layer - NL : Total number of insulating/copper layers - O : Vertical spacing between consecutive insulating layers (m) [Note: Undefined/empty (NaN) for single-layer configurations where NL = 1] - Dbar1 : Derived parameter: Mean geometric perimeter 1 = (D1 + d1) / 2 (m) - Dbar2 : Derived parameter: Mean geometric perimeter 2 = (D2 + d2) / 2 (m) - L : Self-inductance obtained from 3D FEA Maxwell 3D simulations (H) [In 'MEAS': L represents the corresponding inductance to the physical PCB prototypes] Methodology & Simulation Setup:-------------------------------1. FEA Solver Configuration: - Target self-inductances (L) were computed using 3D solvers in ANSYS Maxwell 3D. - Harmonic excitation frequency: 100 kHz. - Computational domain: Bounding analysis region extending 700 mm in each orthogonal direction (x, y, z) with open boundary conditions. - Mesh Discretization: Auto-adaptive global meshing paired with an explicitly defined fine mesh in the immediate winding volume (700,000 to 1,000,000 tetrahedral elements per simulation). - Convergence Criteria: Solver iteration continued until the global energy error dropped below a strict 1% threshold. - Spatial Symmetry: Boundary condition D1 <= D2 was enforced to eliminate redundant spatial orientations and double-counting. 2. Empirical Laboratory Measurements ('MEAS'): - 55 physical PCB prototypes were fabricated using commercial FR-4 processes. - Measured using an HP 4284A Precision LCR Meter operating at 100 kHz. - Open and Short circuit compensation procedures were executed prior to data acquisition to eliminate lead parasitics and contact resistance. - Note: the distance between two layers O is not the same due to the way PCBs are printed. Divinding the total height over the number of layers minus 1 (NL-1) gives an accurate estimation. 3. Derived Features: - Derived variables (Dbar1, Dbar2) follow Current Sheet Approximation (CSA) principles to facilitate exact reproduction of the analytical equations proposed in the associated publication without needing to reverse-engineer the inner aperture dimensions. Contact Info: [e-mail]