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"A novel multi-scale thermal contact resistance model for IGCTs"

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DataCite Commons2025-07-25 更新2026-05-03 收录
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https://ieee-dataport.org/documents/novel-multi-scale-thermal-contact-resistance-model-igcts
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资源简介:
"Based on the measured surface parameters and others, combined with the proposed novel multi-scale TCR model, the junction-to-case thermal resistance of existing IGCT devices is calculated. At the same time, the results obtained using the CMY model are compared with those of the proposed model."
提供机构:
IEEE DataPort
创建时间:
2025-07-25
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