Data for: High-performance epoxy/binary spherical alumina composite as underfill material for electronic packaging
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https://data.mendeley.com/datasets/d7xvd77rfp
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资源简介：
Flowability of EP-S-Al2O3 binary composite; AC conductivity, thermal conductivity and shear viscosity of EP-S-Al2O3 binary composites.
创建时间：
2018-12-26
