Data for: High-performance epoxy/binary spherical alumina composite as underfill material for electronic packaging

Flowability of EP-S-Al2O3 binary composite; AC conductivity, thermal conductivity and shear viscosity of EP-S-Al2O3 binary composites.EP-S-Al₂O₃二元复合材料的流动性能；EP-S-Al₂O₃二元复合材料的交流电导率、导热系数与剪切黏度。