Data for Advanced Metrology Suite for Linking Residual Stress to FundamentalProperties of Thermoset Packaging Materials

Name: Data for Advanced Metrology Suite for Linking Residual Stress to FundamentalProperties of Thermoset Packaging Materials
Creator: National Institute of Standards and Technology
Published: 2025-04-26T00:39:24+08:00

data.gov2025-04-26 收录

电子封装材料表征

残余应力

数据链接：

https://catalog.data.gov/dataset/data-for-advanced-metrology-suite-for-linking-residual-stress-to-fundamentalproperties-of-数据链接链接失效反馈

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资源简介：

This repository contains data generated to support and ECTC 2025 conference manuscript titled "Advanced Metrology Suite for Linking Residual Stress to Fundamental...

本数据集仓库包含为支撑一篇ECTC 2025会议手稿所生成的数据，该手稿题为"用于将残余应力与基础……相联系的先进计量套件"

提供机构：

National Institute of Standards and Technology

Data for Advanced Metrology Suite for Linking Residual Stress to FundamentalProperties of Thermoset Packaging Materials

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