封装基板材料功率半导体新能源汽车电驱模块结温测试试验数据集

该数据集是中车时代电动汽车股份有限公司在参与新型器件在新能源汽车电机驱动系统中的示范应用项目中，基于任务要求，实时监测新能源汽车电机驱动系统在地面台架不同工况测试条件下的IGBT芯片结温测试数据。采集的数据内容包括NTC温度、热成像、转矩、转速、效率、电压、电流、功率因数等数据，用到的工具主要包括热成像仪、功率分析仪、热电偶和计算机。相关数据为试验记录的原始数据，不需要加工处理，数据量472KB。

This dataset consists of real-time IGBT chip junction temperature test data collected by CRRC Times Electric Vehicle Co., Ltd. for the demonstration application project of new devices in new energy vehicle motor drive systems. The data was acquired under various ground bench test conditions of the motor drive system based on the project requirements.
The collected content includes NTC temperature, thermal imaging data, torque, rotational speed, efficiency, voltage, current, power factor and other related parameters. The main instruments and tools used in data collection include thermal imagers, power analyzers, thermocouples and computers.
All relevant data are original experimental records without any post-processing, with a total data size of 472 KB.

搜集汇总

背景与挑战

背景概述

该数据集由中车时代电动汽车股份有限公司在新能源汽车电机驱动系统示范应用项目中创建，提供了地面台架不同工况下IGBT芯片结温的测试数据。它包含NTC温度、热成像、转矩、转速、效率、电压、电流、功率因数等原始记录，数据量约472KB，采集工具涉及热成像仪和功率分析仪等。