Patent AT-E400002-T1: [Translated] METHOD FOR PRODUCING A WEDGE-FREE ADHESIVE JOINT

Name: Patent AT-E400002-T1: [Translated] METHOD FOR PRODUCING A WEDGE-FREE ADHESIVE JOINT
Creator: U.S. Department of Health & Human Services
Published: 2025-12-20T03:48:28+08:00

data.gov2025-12-20 收录

粘接工艺优化

无楔形接头制造

数据链接：

https://catalog.data.gov/dataset/patent-at-e400002-t1-translated-method-for-producing-a-wedge-free-adhesive-joint 数据链接链接失效反馈

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资源简介：

The inventive method for the wedge-free bonding of planar surfaces comprises, in essence, a concluding phase involving bringing the surfaces to be bonded closer...

本发明提出的平面无楔键合（wedge-free bonding）方法，本质上包含一个终了阶段，该阶段涉及使待键合的平面相互靠拢……

提供机构：

U.S. Department of Health & Human Services

Patent AT-E400002-T1: [Translated] METHOD FOR PRODUCING A WEDGE-FREE ADHESIVE JOINT

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