SERS spectrum of RHB solution measured on different patterns

A novel surface-enhanced Raman scattering substrate based on integrated circuit (IC) process was designed, using photolithography, etching and other processes on the silicon wafer processing. Its surface morphology and Raman activity were characterized and tested. The relationship between the substrate’s photolithographic pattern and its Raman activity, stability and reproducibility has been analyzed and verified.

本团队设计了一种新型的基于集成电路（IC）工艺的表面增强拉曼散射基板，该基板通过光刻、蚀刻等工艺在硅晶圆加工过程中制成。对其表面形貌和拉曼活性进行了表征与测试。对基板的光刻图案与其拉曼活性、稳定性及重现性之间的关系进行了分析与验证。