FORMATION OF THERMAL PHENOMENA IN METAL–COMPOSITE CONTACTS AND THEIR MANIFESTATION LAWS

This article provides a comprehensive analysis of thermal phenomena occurring in metal–composite contacts, their formation mechanisms, and the laws governing their manifestation. In modern electronic and electrical engineering devices, metal–semiconductor composite contacts play a crucial role, particularly silicon-based contact systems, which exhibit high efficiency. Therefore, a detailed study of thermal processes in such systems is of significant scientific importance. Within the scope of this study, composite contacts based on silicon (Si) and various metal elements—iron (Fe), copper (Cu), nickel (Ni), and tin (Sn)—were investigated. The selection of these materials was based on significant differences in their physical, electrical, and thermal properties. Heat generation in metal–composite contacts is primarily explained by the Joule–Lenz effect induced by electric current flow. In this case, the amount of generated heat increases proportionally to the square of the current, contact resistance, and time. Furthermore, the study examines the influence of microstructural changes, diffusion processes, and phase transformations occurring at the contact interface on thermal behavior. In particular, at elevated temperatures, diffusion of metal atoms into silicon modifies the structure of the contact region, thereby affecting both thermal conductivity and electrical resistance. The results show that Si–Cu composite contacts possess high thermal conductivity, enabling efficient heat dissipation and reduced local heating. In contrast, Si–Sn composite contacts exhibit greater heat accumulation due to low melting temperature and poor thermal conductivity, which reduces their stability. In Si–Ni and Si–Fe systems, oxidation and diffusion processes are more pronounced.