Design of a Compact High-Power Combiner Integrated into a Printed Circuit Board with Matching and Transforming Circuits

Advances in microwave transistor technology have led to increased output power, creating a demand for compact power combiners capable of handling high power levels. However, scientific literature lacks sufficient examples of high-power combiner designs that maintain small form factors.  This work presents the design, simulation, and prototyping of a compact edge-coupled power combiner integrated into a multilayer printed circuit board (PCB) using standard PCB fabrication techniques. The developed combiner is designed to handle power levels up to 2 kW with a duty cycle of at least 10, operating in the 2700\u20132900 MHz frequency range. The proposed combiner structure is analyzed using: circuit simulation in AWR Design Environment (AWR DE), 3D electromagnetic (EM) modeling of microwave structures in CST Studio Suite, thermal analysis in COMSOL Multiphysics. The validity of the design and simulations is confirmed through prototype testing. The practical significance of this work lies in the development of a PCB-integrated power combiner, ensuring high manufacturing precision and excellent dielectric strength while maintaining a compact.