SHPhoneBench: A Multi-Modal Benchmark for Second-Hand Smartphone Valuation with Heterogeneous Inspection Signals

SHPhoneBench is a multi-modal benchmark for second-hand smartphone valuation built from real recycling workflows in mainland China (January 2024 – March 2026). The full corpus contains 73,200 transaction-aligned records; a curated 15,000-sample benchmark subset carries five-tier condition grades, 18-category defect bounding boxes, cross-modal consistency labels, and differentially private transaction prices. Each record links four heterogeneous inspection signals collected during the same physical inspection:- V — multi-view exterior photographs of the device.- T — informal Chinese technician remarks (free-text).- S — structured CRM / device metadata (JSON).- IS — desktop diagnostic-tool screenshots. Tasks supported by the benchmark:- T1 — five-tier condition grading (Macro-F1, QWK).- T2 — 18-category defect detection / grounding (mAP@0.5, Grounding Acc@0.5).- T3 — binary cross-modal consistency check (F1).- T4 — calibrated price regression with 90% predictive interval (MAE in CNY, ECE). Privacy and compliance:- Faces, serial numbers, and Apple IDs are removed or masked prior to release.- List prices are released with Laplace differential privacy (epsilon = 0.1).- Collection consent is aligned with PIPL. This Zenodo record hosts the benchmark release archive, a sample manifest CSV, and a Croissant 1.1 metadata file (with MLCommons RAI 1.0 fields). Please see the accompanying paper for the full datasheet, ethics statement, and intended-use restrictions.