Printing 3D interconnects by filament drawing

A micro-printing method was proposed based on filament drawing to fabricate 3D interconnects. The process involves forming a meniscus under the tension of the ink, and the delicate structure is drawn out from the meniscus when printing. The printing material is an ink composed of silver nanoparticles (AgNPs) and polyvinylpyrrolidone (PVP). The viscosity is controlled bsy evaporating the ink’s solvent to facilitate meniscus formation. This unique printing method utilizes a single needle, controlled by precise air pressure and speed, to construct 3D structures with varying wire widths. The 3D architectures exhibit superior structural retention and enhanced conductivity following thermal treatment. The drawing printing method has been successfully implemented on flexible circuits, including light-emitting diode (LED) arrays, thermal imaging displays, and multivibrator circuits. These applications reveal significant potential for flexible, integrated circuits and personalized manufacturing applications. The proposed technique promises the manufacturing of 3D interconnects essential for future integrated, flexible electronics.