Patent AT-E40157-T1: [Translated] SELECTIVE PLATING.

Name: Patent AT-E40157-T1: [Translated] SELECTIVE PLATING.
Creator: U.S. Department of Health & Human Services
Published: 2025-12-20T06:58:12+08:00

data.gov2025-12-20 收录

选择性电镀工艺

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数据链接：

https://catalog.data.gov/dataset/patent-at-e40157-t1-translated-selective-plating 数据链接链接失效反馈

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资源简介：

A method of selective plating a component such as a header (3), wherein the header (3) is mounted in a jig (7), a resilient silicone rubber mask (1) having a stepped...

一种针对诸如集管（header）之类的工件的选择性电镀方法，该方法中将集管（3）安装于夹具（jig，7）内，并采用带有阶梯结构的弹性硅橡胶掩膜（1）……

提供机构：

U.S. Department of Health & Human Services

Patent AT-E40157-T1: [Translated] SELECTIVE PLATING.

资源简介：

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