Fatigue of Metal-Ceramic Substrates through Thermal Cycling and Its Consequences for Silver-Sintered Joint Reliability
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Publication data for the article "Fatigue of Metal-Ceramic Substrates through Thermal Cycling and Its Consequences for Silver-Sintered Joint Reliability" by Stegmann et al. published in Journal of Materials Science: Materials in Electronics (JMSE)
提供机构：
Technische Universität Darmstadt
创建时间：
2025-10-06
