Data underlying the publication: The nature of silicon PN junction impedance at high frequency

This package contains data and code associated with the publication "The nature of silicon PN junction impedance at high frequency".<br>The package contains:<br>All TCAD-generated admittance data related to the publication (.xlsx). This folder contains subfolders, each corresponding to one of the results section of the publication.One MATLAB file (.m) used to analyze the admittance data from folder 1 using both the (1) CNLS method and (2) the analytic method.<br>

本套件包含与发表论文《高频下硅PN结阻抗的特性》相关的数据与代码。<br>本套件包含以下内容：<br>所有与该论文相关的、由工艺计算机辅助设计（Technology Computer-Aided Design, TCAD）生成的导纳数据（格式为.xlsx）。该数据集文件夹包含若干子文件夹，每个子文件夹对应论文中的一个结果章节。另有1个MATLAB脚本文件（.m格式），用于采用（1）CNLS方法与（2）解析方法对文件夹1中的导纳数据进行分析。