Patent AT-E400894-T1: [Translated] COOLED ELECTRONIC ARRANGEMENT AND METHOD FOR COOLING A CIRCUIT BOARD

Name: Patent AT-E400894-T1: [Translated] COOLED ELECTRONIC ARRANGEMENT AND METHOD FOR COOLING A CIRCUIT BOARD
Creator: U.S. Department of Health & Human Services
Published: 2025-12-20T03:24:17+08:00

data.gov2025-12-20 收录

电子热管理

电路板冷却技术

数据链接：

https://catalog.data.gov/dataset/patent-at-e400894-t1-translated-cooled-electronic-arrangement-and-method-for-cooling-a-cir 数据链接链接失效反馈

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资源简介：

A cooled electronic assembly includes an integrated-circuit device carrier (such as a printed circuit board), a device (such as a flip chip), a liquid pump, a molding...

该冷却电子组件包含集成电路器件载体（例如印刷电路板（Printed Circuit Board））、器件（例如倒装芯片（Flip Chip））、液泵以及模塑组件……

提供机构：

U.S. Department of Health & Human Services

Patent AT-E400894-T1: [Translated] COOLED ELECTRONIC ARRANGEMENT AND METHOD FOR COOLING A CIRCUIT BOARD

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