METHOD FOR APPLYING GLUE TO WOOD CHIPS

The invention relates to a method for applying glue to comminuted lignocellulosic particles (10) in the production of material boards， in which a glue which can be cured by temperature and/or addition of curing agents and comprises at least one formation of colloids is brought via a conveying device (2) of adjustable volumetric flow rate and via conveying lines (15a， 15c) to a dispersing unit (1) in which the glue is homogenised by means of a comminution device and a mixing device and is then conveyed via conveying lines (15a) to nozzle assemblies (6) which spray the glue onto the particles (10) in a mixing chamber (5). According to the invention， the amount of glue conveyed is determined and assigned in an evaluation unit (8) to a rotation speed of the dispersing unit， and this rotation speed is then set to ensure sufficient viscosity and reactivity for the production of material panels in a glue which is used for wetting lignocellulosic particles， in particular wood chips.