碳化硅陶瓷材料性能数据集

本数据集面向高性能碳化硅陶瓷材料研发需求，依托国家重点研发计划（2021YFB3704300），于2021-2025年间在中国科学院上海硅酸盐研究所等单位，通过阿基米德排水法、超声波脉冲激发法、激光闪射法及热机械分析等标准化测试手段系统采集。数据内容涵盖体积密度、弹性模量、室温热导率及10–30℃热膨胀系数等关键性能指标，包含多组平行样测试结果及显微结构图像。数据集格式包括pdf、tif、jpg、word，旨在为碳化硅材料配方设计、工艺优化与工程应用提供可靠的数据支撑。This dataset is tailored for the research and development of high-performance silicon carbide ceramic materials. It is supported by the National Key R&D Program of China (Grant No. 2021YFB3704300), and was systematically collected between 2021 and 2025 by the Shanghai Institute of Ceramics, Chinese Academy of Sciences and other relevant institutions using standardized testing methods including Archimedes' displacement method, ultrasonic pulse excitation method, laser flash method and thermomechanical analysis. The dataset covers key performance indicators such as bulk density, elastic modulus, room-temperature thermal conductivity, and thermal expansion coefficient in the range of 10–30°C, as well as test results of multiple parallel samples and microstructure images. The dataset is provided in formats including PDF, TIF, JPG and Word documents, and aims to provide reliable data support for the formulation design, process optimization and engineering applications of silicon carbide materials.

搜集汇总

背景与挑战

背景概述

该数据集面向高性能碳化硅陶瓷材料研发，系统采集了体积密度、弹性模量、室温热导率及热膨胀系数等关键性能指标。数据通过阿基米德排水法、超声波脉冲激发法等标准化测试方法获得，旨在为材料配方设计、工艺优化与工程应用提供可靠的数据支持。