Circular TwAIn WEEE Pilot Dataset 3D Imaging

Circular TwAIn WEEE Pilot Dataset 3D Imaging This dataset contains a collection of visual and 3D point cloud data of personal computer (PC) internals, captured from a top-down perspective with the PC lids open. It is designed for applications in computer vision, machine learning, and robotic perception related to hardware component identification, pose estimation, and 3D reconstruction. Dataset Contents The dataset is organized into two main directories: top/ Contains 470 RGB images in .bmp format. Captured using a high-resolution RGB camera mounted above the testbed. Images clearly show various hardware components such as the motherboard, CPU, RAM, power supply, and internal cabling. pointcloud/ Contains 810 point cloud files in .ply format. Captured using a RGB-D camera (e.g., Photoneo) positioned similarly above the PC. Each point cloud includes both 3D depth and RGB color information. Camera Setup Both the RGB and RGB-D cameras were mounted above the data acquisition setup to ensure consistent top-view perspectives. While the cameras were co-located during data capture, exact extrinsic calibration or world coordinate alignment is not provided. Applications This dataset is suitable for tasks such as: PC hardware component detection and classification 3D reconstruction of PC internals Depth estimation and pose estimation in cluttered environments Training perception models for robotic manipulation, repair, or assembly