Microstructure data from "Influence of the Al content on the brittle-to-ductile transition temperature of ordered binary Fe-Al alloys"

The following file deisgnations are used: Fe30Al: alloy with nominal 30 at.% Al and 70 at.% FeFe35Al: alloy with nominal 35 at.% Al and 65 at.% FeFe42Al: alloy with nominal 42 at.% Al and 58 at.% FeFe47Al: alloy with nominal 47 at.% Al and 53 at.% Fe RT: Testing temperature was room temperature (20°C)250C: Testing temperature was 250°C400C: Testing temperature was 400°C500C: Testing temperature was 500°C600C: Testing temperature was 600°C700C: Testing temperature was 700°C 01/02/03/04: denotes a consecutive number for differentiating between different samples BSE: Scanning electron microscopy (SEM) images were taken in backscattered electron (BSE) mode at 20kV acceleration voltageSE: Scanning electron microscopy (SEM) images were taken in secondary electron (SE) mode at 20kV acceleration voltageEBSD: Scanning electron microscopy (SEM) analysis of electron backscatter diffraction (EBSD) at 20kV acceleration voltage 100x: Magnification in SEM LD: abbreviation for load direction ver: abbreviation for vertical 800x800x2: field of yiew in micrometer: 800 micron wide, 800 micron high, 2 micron pixel size for EBSD800x800x5: field of yiew in micrometer: 800 micron wide, 800 micron high, 5 micron pixel size for EBSD400x400x2: field of yiew in micrometer: 400 micron wide, 400 micron high, 2 micron pixel size for EBSD B8x8: Binning size of 8x8 Further details are found in the preprint linked to this dataset. ------------ We gratefully acknowledge financial support by the Deutsche Forschungsgemeinschaft (DFG) within the framework of the project no. 511095365 (HE1872-44/1 and KA4631-4/1 at KIT, STE1077-3/1 and BE7628/1-1 at MPI SusMat). This work was partly carried out with the support of the Karlsruhe Nano Micro Facility (KNMFi, proposal no. 2025-035-032491, www.knmf.kit.edu), an Open Access Research Infrastructure within the Karlsruhe High Technology Hub at the Karlsruhe Institute of Technology (KIT – The University in the Helmholtz Association, www.kit.edu). We acknowledge the chemical analysis by ICP-OES, CGHE and CA at the Institute for Applied Materials (IAM-AWP) by Dr. Bergfeldt, Karlsruhe Institute of Technology (KIT) and support by Dr. Anwesha Kanjilal (MPI SusMat) within the framework of this project.