Data from: Unveiling hysteresis of transient boiling: A multimodal perspective

Boiling is widely used in thermal management systems of electronic and
energy devices due to its exceptional mass efficiency. However, hysteresis
present during boiling makes the boiling curve unable to return along the
same path as the rising curve, hindering a thermal management system from
achieving precise temperature control. Such thermal crises increase both
system instability and the likelihood of system failure. Some studies have
explored hysteresis based on steady-state boiling, identifying several
types of hysteresis during nucleate boiling. However, the impact of
critical heat flux (CHF) on a boiling cycle has not been considered.
Therefore, this paper explores hysteresis in transient boiling from a
multimodal perspective, offering insights into possible indicators for
active and passive thermal control. Multimodal sensing, which integrates
thermal, optical, and acoustic measurements, is employed to collect data
during transient pool boiling on a copper foam surface. Then, time and
frequency domain analyses are conducted on these multimodal data to unveil
hysteresis. Based on this research, the hysteresis observed in a complete
transient boiling cycle involving CHF can be classified into three
categories: nucleation hysteresis (ΔV hysteresis), burnout hysteresis (CHF
hysteresis), and pressure change hysteresis (ΔP hysteresis). The
mechanisms underlying these types of hysteresis and their multimodal
behaviors are elucidated based on the analysis results. Finally, the
impact of hysteresis and strategies for its mitigation are discussed. It
is observed that smooth surfaces, such as plain copper, exhibit more
pronounced nucleation hysteresis compared to hierarchical porous surfaces,
such as copper foams.