Dataset in support of the journal article 'Vacuum thermoforming for packaging flexible electronics and sensors in e-textiles'.

The dataset contains excel files supporting the figures presented in the journal article by A Valavan, A Komolafe, N R. Harris and S Beeby "Vacuum thermoforming for packaging flexible electronics and sensors in e-textiles" published in Transactions on Components, Packaging and Manufacturing Technology. This dataset contains data for: Fig. 4. Temperature measurement for different heat powers (3 separate measurements) Fig. 10. Peel strength for Platilon U 4201 AU on Kapton N after vacuum forming and hot air gun at 230ºC. Uneven peaks indicate non-uniform bonding Fig. 11. Peeling test of Platilon U 4201 AU on Kapton E after vacuum forming and hot air gun at 230ºC for bonding Fig. 14: Comparison between CO sensor response for encapsulated versus unencapsulated circuits with temperature and humidity readings at the time of testing. Fig. 16: Average number of bending cycles survived by unpackaged and packaged flexible CO and series resistors filaments Fig. 17. Average number of wash cycles survived by unpackaged and packaged flexible CO and series resistors filaments