Patent AT-E401770-T1: [Translated] HEAT DISSIPATION IMPROVEMENTS FOR ELECTRONIC ENCLOSURES

Name: Patent AT-E401770-T1: [Translated] HEAT DISSIPATION IMPROVEMENTS FOR ELECTRONIC ENCLOSURES
Creator: U.S. Department of Health & Human Services
Published: 2025-12-20T06:38:05+08:00

data.gov2025-12-20 收录

电子散热设计

高密度封装热管理

数据链接：

https://catalog.data.gov/dataset/patent-at-e401770-t1-translated-heat-dissipation-improvements-for-electronic-enclosures 数据链接链接失效反馈

官方服务：

资源简介：

An electronics enclosure is provided. The enclosure includes a cylindrical body, one or more modular card cages adapted to receive one or more electronic circuit...

本数据集提供一款电子机箱（electronics enclosure），其设有圆柱形壳体与一个或多个适配于容纳一个或多个电子电路的模块化插箱（modular card cages）……

提供机构：

U.S. Department of Health & Human Services

Patent AT-E401770-T1: [Translated] HEAT DISSIPATION IMPROVEMENTS FOR ELECTRONIC ENCLOSURES

资源简介：

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