Optical Profilometer Dataset for Diced Surfaces Obtained with Wafer Dicing Machine at Varying Feed Velocities

Fused silica wafers (1mm thickness) were diced with a wafer dicing machine (Disco DAD3350) at different feed velocities to analyze the impact on the surface roughness. The surface roughness was measured with an optical profilometer (Keyence VK-X3000) in white light interferometer mode. Raw data from the interferometer measurements and a README file are included in this dataset.