DISASSEMBLY AND SEPARATION ADHESIVE TAPE FOR INTEGRATED ELECTRONIC PRODUCTS， STRUCTURE THEREOF AND PREPARATION PROCESS THEREFOR
收藏国家林业和草原科学数据中心2023-02-12 更新2024-03-07 收录
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资源简介：
Disclosed in the present invention are a disassembly and separation adhesive tape for integrated electronic products， a structure thereof and a preparation process therefor. The disassembly and separation adhesive tape comprises: one， two， three， four or more silica gel layers. When there are two or more silica gel layers， two silica gel layers which are vertically symmetrically arranged are a first silica gel layer and a second silica gel layer， and an adhesive tape layer is provided between the first silica gel layer and the second silica gel layer. The adhesive tape layer comprises an adhesive A surface and an adhesive B surface， and a buffer layer having a hollow microsphere foaming structure is provided between the adhesive A surface and the adhesive B surface. The disassembly and separation adhesive tape can not only make the tape easy to peel off from electrical components， but also has good cushioning properties to prevent damage to parts.
提供机构：
国家林业和草原科学数据中心
创建时间：
2023-02-12
