2D High-Temperature Superconductor Integration in Contact Printed Circuit Boards

Inherent properties of superconducting Bi2Sr2CaCu2O8+x films,
such as the
high superconducting transition temperature Tc, efficient Josephson coupling between neighboring CuO layers,
and fast quasiparticle relaxation dynamics, make them a promising
platform for advances in quantum computing and communication technologies.
However, preserving two-dimensional superconductivity during device
fabrication is an outstanding experimental challenge because of the
fast degradation of the superconducting properties of two-dimensional
flakes when they are exposed to moisture, organic solvents, and heat.
Herein, to realize superconducting devices utilizing two-dimensional
(2D) superconducting films, we develop a novel fabrication technique
relying on the cryogenic dry transfer of printable circuits embedded
into a silicon nitride membrane. This approach separates the circuit
fabrication stage requiring chemically reactive substances and ionizing
physical processes from the creation of the thin superconducting structures.
Apart from providing electrical contacts in a single transfer step,
the membrane encapsulates the surface of the crystal, shielding it
from the environment. The fabricated atomically thin Bi2Sr2CaCu2O8+x-based
devices show a high superconducting transition temperature of Tc ≃ 91 K close to that of the bulk crystal
and demonstrate stable superconducting properties.