Pumpdown curves of samples tested for vacuum compatibility during the development of electroless copper on SLA resin electron and ion device manufacturing process

Name: Pumpdown curves of samples tested for vacuum compatibility during the development of electroless copper on SLA resin electron and ion device manufacturing process
Creator: Wrocław University of Science and Technology
Published: 2026-03-02T07:49:33+08:00

RepOD Repository for Open Data2026-03-02 更新2026-07-23 收录

真空兼容性测试

化学镀铜工艺开发

数据链接：

https://repod.icm.edu.pl/dataset.xhtml?persistentId=doi:10.18150/P2BNC1 数据链接链接失效反馈

官方服务：

资源简介：

Sobków, Jan, 2026, "Pumpdown curves of samples tested for vacuum compatibility during the development of electroless copper on SLA resin electron and ion device manufacturing process", https://doi.org/10.18150/P2BNC1, RepOD, V1

提供机构：

Wrocław University of Science and Technology

创建时间：

2026-03-02