Method of manufacturing resin-in-paper electronics and use of manufactured products

The present invention relates to one or more resin impregnated resins in such a way as to fill the pores (or holes) of the porous networks of cellulose fibers， in particular to saturate the porous networks of cellulose fibers and to coat the outer surfaces of electronic devices printed with resin. A paper-based printed electronic device comprising a paper sheet. A fully encapsulated electronic device is obtained that is protected from external environmental and physical damages such as moisture and oxygen， and has sufficient resistance to tearing. The impregnated and encapsulated electronic device can be successfully integrated into an object in the form of a flat or curved monolithic structure. This can be achieved in particular through the lamination process since the device maintains high pressure and high temperature， does not create bubbles， does not peel off and can be completely embedded in the final product. The invention relates to a paper-based printed electronic device comprising one or more sheets of paper that is impregnated with a resin in way to fill the voids (or pores) of porous networks of cellulose fibers and in particular to saturate said porous networks of cellulose fibers， aswell as to coat the outer surfaces of the printed electronics with said resin. A fully encapsulated electronic device is obtained which is protected against external environmental and physical damages such as against moisture and oxygen and has acquired sufficient resistance to tearing. The impregnated and encapsulated electronic device can then be successfully integrated into an object in a form of a flat or curved monolithic structure. This may especially be achieved through a lamination process， as saiddevice sustains high pressure， high temperature， does not create bubbles， does not delaminate， and can be fully embedded into an end product. The invention relates to a paper-based printed electronic device comprising one or more sheets of paper that is impregnated with a resin in way to fill the voids (or pores) of porous networks of cellulose fibers and in particular to saturate said porous networks of cellulose fibers， aswell as to coat the outer surfaces of the printed electronics with said resin. A fully encapsulated electronic device is obtained which is protected against external environmental and physical damages such as against moisture and oxygen and has acquired sufficient resistance to tearing. The impregnated and encapsulated electronic device can then be successfully integrated into an object in a form of a flat or curved monolithic structure. This may especially be achieved through a lamination process， as saiddevice sustains high pressure， high temperature， does not create bubbles， does not delaminate， and can be fully embedded into an end product.