Evaluation of IRT-NDT for solder in solenoid coil connector

This is a compilation of the results on the measurements of temperatures by using thermocouples and an infrared camera to test the capacity of Infrared Thermography Nondestructive Methodology to detect solder joint defects in a connector of a particular solenoid coil. Discrimination analyses results, as well as repeatibility analyses results, are given. The ANOVA based discrimination analyses make paired comparisons among the good solder and defective solders, providing a probability of being the same (P) with a 95% confidence interval, as well as the minimum, mean, and maximum differences in excess temperatures encountered. Minimum differences in excess temperature larger than 2 degrees Celsius give a conservative criterion to determine if a defective solder joint can be distinguished from a good solder joint.

本数据集汇总了采用热电偶与红外相机进行温度测量所得的实验结果，旨在验证红外热成像无损检测方法（Infrared Thermography Nondestructive Methodology）在某款电磁线圈连接器中检测焊点缺陷的能力。本数据集同时包含鉴别分析与重复性分析的结果。基于方差分析（ANOVA）的鉴别分析对合格焊点与缺陷焊点开展配对比较，给出了二者一致性概率（P）及其95%置信区间，同时提供了实测超额温差的最小值、均值与最大值。当超额温差最小差值大于2摄氏度时，可作为保守判定准则，用于区分缺陷焊点与合格焊点。