Electronic Components
收藏DataCite Commons2022-03-24 更新2025-04-16 收录
下载链接：
https://etsin.fairdata.fi/dataset/6da9b680-0786-471b-a9ca-9def6dec473c
下载链接
链接失效反馈官方服务：
资源简介：
Electronic components imaged to generate a 3D-model for Finite Element Method modeling, to investigate a related phenomenon from other measurements. Components are IGBT semiconductor modules, EconoPACK and HiPak. Preview dataset found at https://doi.org/10.23729/41fa6cbf-5bb1-4f67-98a9-088bfc034f33 . To obtain data, please contact fairdata-pas@gtk.fi .
提供机构：
Jukka Kuva
创建时间：
2022-03-24
