Electronic Components
收藏官方服务：
资源简介：
Electronic components imaged to generate a 3D-model for Finite Element Method modeling, to investigate a related phenomenon from other measurements. Components are IGBT semiconductor modules, EconoPACK and HiPak. Preview dataset found at https://doi.org/10.23729/41fa6cbf-5bb1-4f67-98a9-088bfc034f33 . To obtain data, please contact fairdata-pas@gtk.fi .
提供机构：
Jukka Kuva创建时间：
2022-03-24
