Data from: Fabrication and characterization of Ni-decorated h-BN powders with ChCl-EG ionic liquid as addition by electroless deposition

Electroless plating nickel particles on hexagonal boron nitride (h-BN) of ceramic powders are investigated in this paper. As comparison, the different additive concentration of choline chloride-ethylene glycol (ChCl-EG) ionic liquid (0g/L, 30g/L, 60g/L, 90g/L) is presented. The effects of ChCl-EG concentration are studied, including the surface morphologies, phase analysis of Ni-decorated h-BN powders, and the residual Ni2+ concentration is measured in electroless plating bath. It is demonstrated that the deposition phenomena of nickel particles on h-BN surface is changed with the addition of ChCl-EG. When the concentration of ChCl-EG is 30g/L, the Ni particles on h-BN surface are in dispersed and spheroid state with the average size of 10-1000nm. It can be found that 30g/L ChCl-EG is conducive to the arise of deposition phenomena, which is the formation of the single nickel particle on h-BN surface. Besides, more Ni particles are deposited on h-BN surface with the increase of plating nickel times, which is characterized with scanning electron microscope (SEM) and transmission electron microscope (TEM). Furthermore, the deposition phenomenon and growth mechanism are proposed without and with ChCl-EG as additive to further elaborate the formation of Ni particles on h-BN surface.

本文针对陶瓷粉末六方氮化硼（hexagonal boron nitride，h-BN）表面化学镀镍颗粒的过程展开研究。作为对照，本文设置了不同浓度的氯化胆碱-乙二醇（choline chloride-ethylene glycol，ChCl-EG）离子液体添加剂，浓度梯度分别为0g/L、30g/L、60g/L、90g/L。本文研究了ChCl-EG浓度对表面镀覆镍颗粒的h-BN粉末的表面形貌、物相组成的影响，并对化学镀液中残留的Ni²+浓度进行了检测。研究表明，添加ChCl-EG会改变h-BN表面的镍颗粒沉积行为。当ChCl-EG浓度为30g/L时，h-BN表面的镍颗粒呈分散球状分布，平均粒径为10~1000nm。结果表明，30g/L的ChCl-EG有利于沉积行为的发生，可促进h-BN表面单个镍颗粒的形成。此外，通过扫描电子显微镜（scanning electron microscope，SEM）和透射电子显微镜（transmission electron microscope，TEM）表征发现，随着化学镀次数的增加，h-BN表面沉积的镍颗粒数量随之增多。进一步地，本文分别提出了未添加与添加ChCl-EG时的沉积行为与生长机制，以进一步阐明h-BN表面镍颗粒的形成过程。