Tackling the Stability Issues of Silver Nanowire Transparent Conductive Films through FeCl3 Dilute Solution Treatment

This data set first presents TEM images of 50 nm thick silver nanowires (AgNWs), TEM and high resolution (HR) TEM images of 50 nm thick AgNW processed by FeCl3 dilute solution (DS), and TEM images of AgNW processed by DS for 30, 60, and 90 minutes. Then, the change diagram of sheet resistance of the original AgNW transparent conductive film (TCF) and the film treated with FeCl3DS after aging in air is given. The sheet resistance changes of AgNW TCF without FeCl3 DS treatment and treated for 90 minutes during liquid chemical etching are further given, and the sheet resistance changes of AgNW TCF with original AgNW TCF and FeCl3 DS treatment during H2S gas chemical etching are also given. Comparison of the change of sheet resistance of AgNW TCFs with different diameters of AgNW treated with original AgNW and 60 min FeCl3 DS. SEM images of AgNW TCF processed by FeCl3 DS and 50 nm AgNW raw at different thermal test temperatures. The change of sheet resistance of AgNW TCF with 100 nm thick AgNW in thermal test: original AgNW and AgNWs treated with 0.042 mM FeCl3 DS for 120 minutes. Finally, the effect of FeCl3DS treatment time on the sheet resistance of AgNW TCF with 50 nm thick AgNW is given. The change of film resistance under different bending radius and bending cycle. Schematic diagram of FeCl3 DS treatment of AgNW capillary force induced welding.