Dataset for "Low-temperature processing of screen-printed piezoelectric KNbO3 with integration onto biodegradable paper substrates"

This data set contains the data collected during the FNS project Green Piezo (Grant no. 179064) in association with the recent publication entitled “Low-temperature processing of screen-printed piezoelectric KNbO3 with integration onto biodegradable paper substrates”. <strong>Associated Manuscript Abstract:</strong> "The development of fully solution-processed, biodegradable piezoelectrics is a critical step in the development of green electronics towards the worldwide reduction of harmful electronic waste. However, recent printing processes for piezoelectrics are hindered by the high sintering temperatures required for conventional perovskite fabrication techniques. Thus, a process was developed to manufacture lead-free printed piezoelectric devices at low temperatures to enable integration with eco-friendly substrates and electrodes. A printable ink was developed for screen printing potassium niobate (KNbO₃) piezoelectric layers in microns of thickness at a maximum processing temperature of 120 °C with high reproducibility. Characteristic parallel plate capacitor and cantilever devices were designed and manufactured to assess the quality of this ink and evaluate its physical, dielectric, and piezoelectric characteristics; including a comparison of behavior between conventional silicon and biodegradable paper substrates. The printed layers were 10.7–11.2 μm thick, with acceptable surface roughness values in the range of 0.4–1.1 μm. The relative permittivity of the piezoelectric layer was 29.3. The poling parameters were optimized for the piezoelectric response, with an average longitudinal piezoelectric coefficient for samples printed on paper substrates measured as <em>d</em>_{33,<em>eff</em>,<em>paper</em>} = 13.57 ± 2.84 pC/N; the largest measured value was 18.37 pC/N on paper substrates. This approach to printable biodegradable piezoelectrics opens the way forward for fully solution-processed green piezoelectric devices." The data set consists of the following folders: Device design files Contains data associated with the design and fabrication of printed devices. Includes CAD designs of fabricated devices and py files of computational models Physical characterization data Contains data associated with characterizing the physical properties of the piezoelectric devices Includes particle size analysis data (SEM images of printed layers, collected dimensional data), Profilometry scans, Layer adhesion, ink density, and rheology data. Dielectric characterization data Contains data associated with characterizing the dielectric properties of the piezoelectric devices Includes py analysis script as well as raw data collected for capacitor devices of varying surface area and substrate material Piezoelectric characterization data Contains data associated with characterizing the piezoelectric properties of the devices Includes raw data collected from Berlincourt measurements of samples, matlab scripts for analysis of cantilever samples from Laser Doppler Vibrometry, and raw data collected for cantilever samples of device deflection from LDV measurements Please refer to the included readme files for a detailed description of the contents.本数据集收录了FNS项目「绿色压电（Green Piezo，资助号179064）」实施期间采集的数据，关联的最新发表论文题为《可集成于可降解纸基板的丝网印刷铌酸钾（KNbO₃）压电材料低温制备工艺》。**关联手稿摘要：** "全溶液可加工可降解压电材料的开发，是绿色电子产业迈向全球减少有害电子废弃物目标的关键一环。然而，当前压电材料印刷工艺受限于传统钙钛矿制备工艺所需的高烧结温度。为此，本研究开发了一种低温制备无铅印刷压电器件的工艺，可实现与环保基板及电极的集成。本研究开发了一种可印刷油墨，可在最高加工温度120℃条件下，丝网印刷厚度为微米级的铌酸钾（KNbO₃）压电层，且具备高重复性。设计并制备了典型的平行板电容器与悬臂梁器件，以评估该油墨的性能，并表征其物理、介电与压电特性；包括对比传统硅基板与可降解纸基板的器件行为差异。印刷层厚度为10.7–11.2 μm，表面粗糙度处于0.4–1.1 μm的可接受范围。压电层的相对介电常数为29.3。针对压电响应优化了极化参数，在纸基板上印刷的样品的平均纵向压电系数为<em>d</em>_{33,<em>eff</em>,<em>paper</em>} = 13.57 ± 2.84 pC/N；在纸基板上测得的最大压电系数为18.37 pC/N。这种可印刷可降解压电材料的制备方案，为全溶液可加工绿色压电器件的发展开辟了道路。"本数据集包含以下文件夹： 1. **器件设计文件（Device design files）**：包含与印刷器件设计及制备相关的数据，包括已制备器件的CAD设计图与计算模型的Python脚本文件。 2. **物理特性表征数据（Physical characterization data）**：包含压电器件物理性能表征相关数据，包括粒径分析数据（印刷层的扫描电子显微镜（SEM）图像、采集的尺寸数据）、轮廓仪扫描数据、层间附着力、油墨密度与流变学数据。 3. **介电特性表征数据（Dielectric characterization data）**：包含压电器件介电性能表征相关数据，包括介电分析Python脚本，以及针对不同表面积与基板材质的电容器器件采集的原始数据。 4. **压电特性表征数据（Piezoelectric characterization data）**：包含器件压电性能表征相关数据，包括样品柏林科特法（Berlincourt measurements）采集的原始数据、用于分析悬臂梁样品激光多普勒测振法（Laser Doppler Vibrometry，LDV）数据的Matlab脚本，以及悬臂梁器件偏转的LDV测量原始数据。 请参阅随附的README文件，以获取内容的详细说明。