Effect of etching time and light sources on the shear bond strength of metal brackets to ceramic cylinders
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OBJECTIVE: To evaluate the shear bond strength of brackets bonded to ceramic with Transbond XT resin, etching time intervals (1 and 2 minutes) and three Light sources (Xenon Plasma Arc, LED and Halogen Light ), with and without silane.METHODS: In total, 12 feldspathic ceramic cylinders (15 mm x 20 mm), etched with 10% hydrofluoric acid were used. For light activation, the brackets were divided according to the light source to be used (n-15): LED UltraLume 5 (L); Apollo 95E plasma arc (AP) and Halogen light XL 2500 (H). After 24 h the samples were submitted to shear bond strength testing at crosshead speed of 0.5 mm/minute.RESULTS: The data were submitted to the analysis of variance (ANOVA) and the Tukey test (5%). Bond Strength: UltraLume 5 (11.4 ± 3.56 MPa) was superior to XL 2500 (9.12 ± 2.83 MPa) and Plasma Arc (5.11 ± 2.93 MPa) (p
研究目的:评估采用Transbond XT粘接树脂(Transbond XT)将托槽粘接于陶瓷表面时的剪切粘结强度(shear bond strength),考察蚀刻时长(1分钟与2分钟)、三种光源(氙等离子弧光源、LED与卤素灯),以及使用硅烷偶联剂(silane)与否对粘结效果的影响。 研究方法:本研究共使用12块长石质陶瓷圆柱试件(尺寸为15mm×20mm),采用10%氢氟酸(hydrofluoric acid)进行蚀刻。按照所使用的光固化光源将托槽分为三组(每组n=15):LED UltraLume 5(记为L组)、Apollo 95E等离子弧光源(记为AP组)以及Halogen light XL 2500卤素灯(记为H组)。试件静置24小时后,以0.5mm/min的十字头速度进行剪切粘结强度测试。 研究结果:采用方差分析(ANOVA)与显著性水平为5%的Tukey检验对数据进行统计分析。粘结强度结果显示:UltraLume 5(11.4±3.56MPa)优于XL 2500(9.12±2.83MPa)与等离子弧光源组(5.11±2.93MPa)(p



